CryoNamics fills micro-gaps between surfaces and eliminates air pockets, significantly improving heat transfer and reducing operating temperatures of components.
Top-tier thermal performance for CPUs, GPUs, RAM, and power modules. Faster heat dissipation means higher performance and stability.
The COOLER MASTER CryoNamics thermal pad is an ideal choice for efficient heat transfer between chips and heatsinks. Thanks to phase-change technology, it penetrates micro surface irregularities, eliminates air pockets, and maximizes contact, leading to lower temperatures and higher stability.
The pad achieves an exceptionally low thermal resistance of 0.07 °C*in²/W, accelerating heat dissipation even under demanding conditions. It is silicone-free, making it gentle on sensitive materials and suitable not only for PC builds but also for consumer electronics, automotive, and modular cooling systems.
