The thermal conductive paste IC-Value V1 is intended to fill the gaps between the processor and the cooler, which increases the efficiency of heat dissipation. Due to its electrical non-conductivity, it is suitable for use on memory components, power elements of the motherboard, graphic processors GPU, and more.
Key features:
The paste is of high quality, ensuring long-term use without degrading thermal properties. The package includes a spatula for easy application of the paste.
