The multilayer board improves signal quality, reduces temperatures, and increases the overall platform’s power efficiency for reliable non‑stop operation.
Effortlessly boost memory performance with predefined Intel XMP and AMD EXPO profiles—faster response without lengthy manual tuning.
Built-in wireless networking and a wide range of rear I/O ports for convenient connection of peripherals and networks.
The ASROCK B850 PRO-A WIFI is designed for users who demand uncompromising reliability. The 8-layer PCB ensures stable signal paths, improved power delivery, and efficient heat dissipation, resulting in lower temperatures and higher energy efficiency.
With support for DDR5 memory and profiles Intel XMP and AMD EXPO, you can easily achieve higher frequencies and optimized timings without complex tuning. This delivers fast system responsiveness, higher bandwidth, and stable performance for work, multimedia, and gaming.
