The practical syringe allows convenient dosing and even spreading of a thin layer of paste exactly where it is needed.
The paste fills microscopic gaps between the die and the heatsink, improving heat transfer and reducing operating temperatures of the CPU/GPU.
Sufficient quantity for multiple applications, suitable for PC builds and regular cooling system maintenance.
This modern thermal compound is designed for reliable heat dissipation from CPUs, GPUs, and other chips. Thanks to its optimized composition, it excellently fills microscopic gaps between surfaces and ensures stable operation even under long-term load.
Application takes just seconds — the included application spatula helps you spread a thin, even layer exactly where needed. One 4 g pack is enough for repeated use and helps maintain lower operating temperatures, quieter operation, and longer component lifespan.
