Qoltec Thermal Paste 17.3 W/m·K 4 g Grey

Qoltec thermal paste is designed to efficiently transfer heat from the processor and other components to the cooler. It fills microscopic unevenness between contact surfaces, supporting better cooling and stable computer or notebook operation.

Main advantages:

• Thermal conductivity of 17.3 W/m·K for efficient heat transfer.
• Electrical insulation helps reduce the risk of short circuits in sensitive electronic components.
• Easy and precise application for even coverage of the contact surface.
• Long-term stable properties for reliable cooling system performance.
• The 4 g package is suitable for replacing old thermal paste in a computer or notebook.

For proper application, apply a small amount of paste to the centre of the processor and then spread it evenly. An excessive amount may worsen heat dissipation, so precise and economical application is important.