Thermal Paste Savio TG-03
Thermal Paste Savio TG-03
Excellent Thermal Conductivity
The Savio TG-03 paste ensures efficient heat dissipation thanks to carbon microparticles, adheres perfectly to surfaces, and ensures quick heat transfer.
Practical Multi-Purpose Packaging
The packaging of the paste is designed to prevent drying out after closure, allowing for repeated use.
Safe and Easy Application
The paste is easy to apply, even for inexperienced users. It does not contain metal oxides, which minimizes the risk of electrical shorts.
Thermal Paste Savio TG-03 is designed for perfect filling of microscopic gaps on the surface of the processor and cooler, ensuring maximum thermal conductivity. This ensures fast and effective heat dissipation.
This paste is available in 2 g and 4 g packaging. The packaging is designed to prevent the paste from drying out after closure, allowing for repeated use.
Savio TG-03 does not contain metal oxides, which means it does not conduct electricity. This eliminates the risk of short circuits and reduces corrosive damage to the cooler or processor base.
Specifications
- Thermal Conductivity:
- 13.5 W/m·K
- Weight:
- 2 g / 4 g
- Composition:
- Carbon Micro-Particles
- Suitability:
- For Processors and Coolers
