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The high-performance thermal paste Natec Husky Pack ensures efficient heat dissipation thanks to high thermal conductivity and low thermal resistance. It is non-conductive, non-corrosive, and requires no curing phase – providing optimal heat transfer from the very first power-on. The practical syringe allows precise and clean application. The package contains 10× 1 g of paste.

Precise and clean application

The syringe packaging enables convenient, controlled application of the paste exactly where needed—without mess or waste.

Optimal performance from first startup

The paste requires no curing. It reaches full thermal performance from the very first usage cycle.

Safe non-conductive composition

The electrically non-conductive and non-corrosive compound minimizes the risk of short circuits and protects your components.

The Natec Husky Pack thermal paste is a reliable choice for processors, graphics cards, and other components where stable heat dissipation is crucial. Thanks to low thermal resistance, it ensures rapid heat transfer to the heatsink, helping maintain lower operating temperatures and higher performance.

The paste is electrically non-conductive and chemically stable, minimizing the risk of shorts and corrosion. It delivers full effectiveness immediately after application—no curing time needed. The ergonomic syringe makes dosing easy, even across multiple installations.

Immediate effect – no heating required, optimal heat transfer right from the start.
Safe composition – non-conductive and non-corrosive for worry-free installation.
Precise application – syringe for clean, repeatable spreading.
Value 10-pack – ideal for PC builders, service centers, and enthusiasts.