Genesis Silicon 801 thermal paste 0.5 g
Genesis Silicon 801 thermal paste 0.5 g
High thermal conductivity and low resistance
Strong heat transfer ensures stable temperatures even for high‑performance CPUs/GPUs without compromises.
Precise and clean application
The practical syringe lets even beginners apply the ideal amount of paste.
Safe non‑conductive composition
The paste does not conduct electricity and does not corrode — protecting your components from damage.
GENESIS Silicon 801 is a quality thermally conductive paste designed for demanding PC builds where stable temperatures and reliable performance are crucial. Its high thermal conductivity and low thermal resistance efficiently transfer heat from the processor or graphics card to the heatsink with no burn‑in required — it reaches optimal properties from the first startup.
The paste’s formula is non‑conductive and non‑corrosive, minimizing the risk of short circuits and providing long‑term protection for sensitive components. The practical syringe packaging makes application and storage much easier, so you can lay down a precise layer simply and cleanly.
- Instant performance — no thermal curing cycle required.
- Safe composition — non‑conductive, won’t damage components.
- Easy application — ergonomic syringe for precise dosing.
Specifications
- Type
- Thermally conductive paste (thermal grease)
- Model
- GENESIS Silicon 801
- Weight
- 0.5 g
- Electrical conductivity
- Non‑conductive
- Corrosion
- Non‑corrosive composition
- Application
- Syringe for precise dosing
- Suitable for
- CPUs, GPUs, heatsinks, and other electronic components
- Features
- High thermal conductivity, low thermal resistance, no burn‑in required
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