Universal silicone thermal pad sized 100 × 100 × 1 mm for reliable heat transfer between the chip and heatsink. Provides efficient heat dissipation, is electrically non-conductive, offers excellent thermal impedance and stable adhesion without oxidation or delamination.
This thermally conductive silicone pad is designed to interface power components with heatsinks in PCs, notebooks, set‑top boxes, and other devices. It replaces thermal paste where greater thickness and perfect gap filling are required.
- Accelerates heat transfer from the processor, chipset, memory, or power components to the heatsink
- Excellent thermal impedance and even pressure distribution for a stable contact
- Electrically non-conductive – safe for electronics
- Stable adhesion, does not delaminate or oxidize
- Easy installation – flexible 100 × 100 × 1 mm sheet can be cut to size
Ideal for service and upgrades, helping lower temperatures and improve long‑term cooling reliability.
Specifications
- Material
- Silicone thermal pad
- Sheet dimensions
- 100 × 100 × 1 mm
- Thickness
- 1 mm
- Electrical conductivity
- Non-conductive
- Intended use
- Interfacing chips and heatsinks (CPU, GPU, chipsets, memory)
- Features
- Excellent thermal impedance, stable adhesion, does not delaminate, does not oxidize
