Thermal paste for effective connection with coolers, ideal for dissipating heat from the processor and chipset.
The thermal paste very effectively dissipates heat from the processor, chipset, and other components to the cooler. It has excellent thermal conductivity, ensuring stability and efficiency.
- Does not stratify and does not degrade.
- Non-conductive, ensuring safety during use.
Specifications
- Weight
- 1.5g
- Thermal Conductivity
- Long lifespan without oxidation
- Safety
- Non-conductive
